Connecting fibers, photonic integrated circuits (PICs), lasers and other optical components is still a complex and time-consuming process. Variations in component position, fiber pitch and chip geometry make accurate coupling challenging. Current solutions often rely on active alignment and curing, limiting throughput and making high-volume production difficult.

Demcon Photonics is developing production equipment for a different approach: creating optical interconnects in situ using femtosecond direct laser writing. Instead of requiring every optical component to align precisely with a predefined waveguide, the system first measures the actual position of each optical interface.

Components can therefore be placed using conventional high-speed assembly methods. Once their positions are known, three-dimensional waveguides are written directly into a glass structure between the interfaces. Each optical path can be adapted to the actual geometry of the assembled components.